LIS2DH12
MEMS digital output motion sensor:
ultra-low-power high-performance 3-axis "femto" accelerometer
Datasheet - production data

Description
The LIS2DH12 is an ultra-low-power highperformance three-axis linear accelerometer
belonging to the “femto” family with digital I2C/SPI
serial interface standard output.
The LIS2DH12 has user-selectable full scales of
2g/±4g/8g/16g and is capable of measuring
accelerations with output data rates from 1 Hz to
5.3 kHz.

/*$ [[PP 

Features
 Wide supply voltage, 1.71 V to 3.6 V
 Independent IO supply (1.8 V) and supply
voltage compatible
 Ultra-low power consumption down to 2 μA
 2g/±4g/8g/16g selectable full scales
 I2C/SPI digital output interface
 2 independent programmable interrupt
generators for free-fall and motion detection
 6D/4D orientation detection
 “Sleep-to-wake” and “return-to-sleep” functions

The self-test capability allows the user to check
the functionality of the sensor in the final
application.
The device may be configured to generate
interrupt signals by detecting two independent
inertial wake-up/free-fall events as well as by the
position of the device itself.
The LIS2DH12 is available in a small thin plastic
land grid array package (LGA) and is guaranteed
to operate over an extended temperature range
from -40 °C to +85 °C.

 Free-fall detection

Table 1. Device summary

 Motion detection
 Embedded temperature sensor
 Embedded FIFO
 ECOPACK®, RoHS and “Green” compliant

Order code

Temp.
range [C]

Package

Packaging

LIS2DH12TR

-40 to +85

LGA-12

Tape and
reel

Applications
 Motion-activated functions
 Display orientation
 Shake control
 Pedometer
 Gaming and virtual reality input devices
 Impact recognition and logging

May 2017
This is information on a product in full production.

DocID025056 Rev 6

1/53
www.st.com

Contents

LIS2DH12

Contents
1

2

Block diagram and pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
1.1

Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

1.2

Pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Mechanical and electrical specifications . . . . . . . . . . . . . . . . . . . . . . . 10
2.1

Mechanical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

2.2

Temperature sensor characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

2.3

Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

2.4

Communication interface characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 13

2.5

3

3.2

I2C - inter-IC control interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

Terminology . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
3.1.1

Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

3.1.2

Zero-g level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

Functionality . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
3.2.1

High-resolution, normal mode, low-power mode . . . . . . . . . . . . . . . . . . 16

3.2.2

Self-test . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

3.2.3

6D / 4D orientation detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

3.2.4

“Sleep-to-wake” and “Return-to-sleep” . . . . . . . . . . . . . . . . . . . . . . . . . 18

Sensing element . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

3.4

IC interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

3.5

Factory calibration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

3.6

FIFO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

3.7

Temperature sensor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

Application hints . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Soldering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

Digital main blocks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
5.1

2/53

2.4.2

3.3

4.1

5

SPI - serial peripheral interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Terminology and functionality . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
3.1

4

2.4.1

FIFO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
DocID025056 Rev 6

LIS2DH12

6

Contents
5.1.1

Bypass mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

5.1.2

FIFO mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

5.1.3

Stream mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

5.1.4

Stream-to-FIFO mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

5.1.5

Retrieving data from FIFO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

Digital interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
6.1

I2C serial interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
6.1.1

6.2

I2C operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

SPI bus interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
6.2.1

SPI read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28

6.2.2

SPI write . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29

6.2.3

SPI read in 3-wire mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30

7

Register mapping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

8

Register description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
8.1

STATUS_REG_AUX (07h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33

8.2

OUT_TEMP_L (0Ch), OUT_TEMP_H (0Dh) . . . . . . . . . . . . . . . . . . . . . . 33

8.3

WHO_AM_I (0Fh) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33

8.4

CTRL_REG0 (1Eh) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33

8.5

TEMP_CFG_REG (1Fh) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34

8.6

CTRL_REG1 (20h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34

8.7

CTRL_REG2 (21h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36

8.8

CTRL_REG3 (22h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36

8.9

CTRL_REG4 (23h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37

8.10

CTRL_REG5 (24h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38

8.11

CTRL_REG6 (25h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38

8.12

REFERENCE (26h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39

8.13

STATUS_REG (27h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39

8.14

OUT_X_L (28h), OUT_X_H (29h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40

8.15

OUT_Y_L (2Ah), OUT_Y_H (2Bh) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40

8.16

OUT_Z_L (2Ch), OUT_Z_H (2Dh) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40

8.17

FIFO_CTRL_REG (2Eh) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40

8.18

FIFO_SRC_REG (2Fh) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41

DocID025056 Rev 6

3/53
53

Contents

9

10

4/53

LIS2DH12

8.19

INT1_CFG (30h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41

8.20

INT1_SRC (31h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42

8.21

INT1_THS (32h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43

8.22

INT1_DURATION (33h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43

8.23

INT2_CFG (34h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44

8.24

INT2_SRC (35h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45

8.25

INT2_THS (36h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45

8.26

INT2_DURATION (37h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46

8.27

CLICK_CFG (38h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46

8.28

CLICK_SRC (39h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47

8.29

CLICK_THS (3Ah) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47

8.30

TIME_LIMIT (3Bh) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47

8.31

TIME_LATENCY (3Ch) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48

8.32

TIME_WINDOW (3Dh) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48

8.33

ACT_THS (3Eh) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48

8.34

ACT_DUR (3Fh) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48

Package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
9.1

LGA-12 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49

9.2

LGA-12 packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50

Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52

DocID025056 Rev 6

LIS2DH12

List of tables

List of tables
Table 1.
Table 2.
Table 3.
Table 4.
Table 5.
Table 6.
Table 7.
Table 8.
Table 9.
Table 10.
Table 11.
Table 12.
Table 13.
Table 14.
Table 15.
Table 16.
Table 17.
Table 18.
Table 19.
Table 20.
Table 21.
Table 22.
Table 23.
Table 24.
Table 25.
Table 26.
Table 27.
Table 28.
Table 29.
Table 30.
Table 31.
Table 32.
Table 33.
Table 34.
Table 35.
Table 36.
Table 37.
Table 38.
Table 39.
Table 40.
Table 41.
Table 42.
Table 43.
Table 44.
Table 45.
Table 46.
Table 47.
Table 48.

Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Internal pull-up values (typ.) for SDO/SA0 pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Mechanical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Temperature sensor characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
SPI slave timing values. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
I2C slave timing values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Operating mode selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Turn-on time for operating mode transition. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Current consumption of operating modes. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Internal pin status . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Serial interface pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
I2C terminology . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
SAD+read/write patterns. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Transfer when master is writing one byte to slave . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Transfer when master is writing multiple bytes to slave . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Transfer when master is receiving (reading) one byte of data from slave . . . . . . . . . . . . . 26
Transfer when master is receiving (reading) multiple bytes of data from slave . . . . . . . . . 26
Register address map. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
STATUS_REG_AUX register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
STATUS_REG_AUX description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
WHO_AM_I register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
CTRL_REG0 register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
CTRL_REG0 description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
TEMP_CFG_REG register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
TEMP_CFG_REG description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
CTRL_REG1 register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
CTRL_REG1 description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
Data rate configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
CTRL_REG2 register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
CTRL_REG2 description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
High-pass filter mode configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
CTRL_REG3 register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
CTRL_REG3 description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
CTRL_REG4 register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
CTRL_REG4 description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
Self-test mode configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
CTRL_REG5 register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
CTRL_REG5 description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
CTRL_REG6 register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
CTRL_REG6 description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
REFERENCE register. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
REFERENCE description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
STATUS_REG register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
STATUS_REG description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
FIFO_CTRL_REG register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40

DocID025056 Rev 6

5/53
53

List of tables
Table 49.
Table 50.
Table 51.
Table 52.
Table 53.
Table 54.
Table 55.
Table 56.
Table 57.
Table 58.
Table 59.
Table 60.
Table 61.
Table 62.
Table 63.
Table 64.
Table 65.
Table 66.
Table 67.
Table 68.
Table 69.
Table 70.
Table 71.
Table 72.
Table 73.
Table 74.
Table 75.
Table 76.
Table 77.
Table 78.
Table 79.
Table 80.
Table 81.
Table 82.
Table 83.
Table 84.
Table 85.
Table 86.
Table 87.
Table 88.

6/53

LIS2DH12

FIFO_CTRL_REG description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
FIFO mode configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
FIFO_SRC_REG register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
FIFO_SRC_REG description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
INT1_CFG register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
INT1_CFG description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
Interrupt mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
INT1_SRC register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
INT1_SRC description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
INT1_THS register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
INT1_THS description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
INT1_DURATION register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
INT1_DURATION description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
INT2_CFG register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
INT2_CFG description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
Interrupt mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
INT2_SRC register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
INT2_SRC description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
INT2_THS register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
INT2_THS description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
INT2_DURATION register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
INT2_DURATION description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
CLICK_CFG register. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
CLICK_CFG description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
CLICK_SRC register. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
CLICK_SRC description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
CLICK_THS register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
CLICK_THS register description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
TIME_LIMIT register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
TIME_LIMIT description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
TIME_LATENCY register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
TIME_LATENCY description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
TIME_WINDOW register. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
TIME_WINDOW description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
ACT_THS register. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
ACT_THS description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
ACT_DUR register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
ACT_DUR description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
Reel dimensions for carrier tape of LGA-12 package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
Document revision history. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52

DocID025056 Rev 6

LIS2DH12

List of figures

List of figures
Figure 1.
Figure 2.
Figure 3.
Figure 4.
Figure 5.
Figure 6.
Figure 7.
Figure 8.
Figure 9.
Figure 10.
Figure 11.
Figure 12.
Figure 13.
Figure 14.
Figure 15.

Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Pin connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
SPI slave timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
I2C slave timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
LIS2DH12 electrical connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Read and write protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
SPI read protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Multiple byte SPI read protocol (2-byte example) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
SPI write protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Multiple byte SPI write protocol (2-byte example). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
SPI read protocol in 3-wire mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
LGA-12: package outline and mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
Carrier tape information for LGA-12 package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
LGA-12 package orientation in carrier tape . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
Reel information for carrier tape of LGA-12 package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51

DocID025056 Rev 6

7/53
53

Block diagram and pin description

LIS2DH12

1

Block diagram and pin description

1.1

Block diagram
Figure 1. Block diagram

X+

CHARGE
AMPLIFIER

Y+
Z+

a

CS

A/D
CONVERTER

MUX

I2C

CONTROL
LOGIC

SCL/SPC
SDA/SDI/SDO

SPI

Z-

SDO/SA0

YX-

SELF TEST

TRIMMING
CIRCUITS

Temperature
Sensor

CONTROL LOGIC
&
INTERRUPT GEN.

32 Level
FIFO

CLOCK

INT 1
INT 2

AM10218V2

1.2

Pin description

10

RES
Vdd
RES
GND
GND

11

11

12

12

4 CS

8/53

5

INT1
RES
INT2

4

6

5

(BOTTOM VIEW)

DIRECTION OF THE
DETECTABLE
ACCELERATIONS

DocID025056 Rev 6

SCL/SPC

SDA/SDI/SDO

(BOTTOM VIEW)

(TOP VIEW)

1

1 CSSCL/SPC

7

Y

Pin 1 indicator

SDO/SA0
SDO/SA0

Vdd 8
7
GND

X

14

GND
Vdd_IO

1

Vdd_IO

RES
INT 1
RES

Z

INT 2
RES

Figure 2. Pin connections

SDA/SDI/SDO

LIS2DH12

Block diagram and pin description

Table 2. Pin description
Pin#

Name

1

SCL
SPC

Function
I2C serial clock (SCL)
SPI serial port clock (SPC)
SPI enable

2

CS

I2C/SPI mode selection:
1: SPI idle mode / I2C communication enabled
0: SPI communication mode / I2C disabled

3(1)

SDO
SA0

SPI serial data output (SDO)
I2C less significant bit of the device address (SA0)

4

SDA
SDI
SDO

I2C serial data (SDA)
SPI serial data input (SDI)
3-wire interface serial data output (SDO)

5

Res

Connect to GND

6

GND

0 V supply

7

GND

0 V supply

8

GND

0 V supply

9

Vdd

Power supply

10

Vdd_IO

Power supply for I/O pins

11

INT2

Interrupt pin 2

12

INT1

Interrupt pin 1

1. SDO/SA0 pin is internally pulled up. Refer to Table 3 for the internal pull-up values (typ).

Table 3. Internal pull-up values (typ.) for SDO/SA0 pin
Resistor value for SDO/SA0 pin
Vdd_IO
Typ. (kΩ)
1.7 V

54.4

1.8 V

49.2

2.5 V

30.4

3.6 V

20.4

DocID025056 Rev 6

9/53
53

Mechanical and electrical specifications

LIS2DH12

2

Mechanical and electrical specifications

2.1

Mechanical characteristics
@ Vdd = 2.5 V, T = 25 °C unless otherwise noted(a)
Table 4. Mechanical characteristics

Symbol

FS

So

Parameter

Measurement range(2)

Sensitivity

Test conditions

Min.

Typ.(1)

FS bit set to 00

±2.0

FS bit set to 01

±4.0

FS bit set to 10

±8.0

FS bit set to 11

±16.0

FS bit set to 00;
High-resolution mode

1

FS bit set to 00;
Normal mode

4

FS bit set to 00;
Low-power mode

16

FS bit set to 01;
High-resolution mode

2

FS bit set to 01;
Normal mode

8

FS bit set to 01;
Low-power mode

32

FS bit set to 10;
High-resolution mode

4

FS bit set to 10;
Normal mode

16

FS bit set to 10;
Low-power mode

64

FS bit set to 11;
High-resolution mode

12

FS bit set to 11;
Normal mode

48

FS bit set to 11;
Low-power mode

192

Max.

Unit

g

mg/digit

mg/digit

mg/digit

mg/digit

TCSo

Sensitivity change vs.
FS bit set to 00
temperature

±0.01

%/°C

TyOff

Typical zero-g level
offset accuracy(3)

±40

mg

FS bit set to 00

a. The product is factory calibrated at 2.5 V. The operational power supply range is from 1.71 V to 3.6 V.

10/53

DocID025056 Rev 6

LIS2DH12

Mechanical and electrical specifications
Table 4. Mechanical characteristics (continued)
Parameter

TCOff

Zero-g level change
vs. temperature

Max delta from 25 °C

±0.5

mg/°C

An

Acceleration noise
density

FS bit set to 00, High-Resolution
mode (Table 10), ODR > 1300 Hz

220

μg/√Hz

Vst

Top

Test conditions

Typ.(1)

Symbol

Min.

Max.

Unit

FS bit set to 00
X-axis; Normal mode

17

360

LSb

FS bit set to 00
Self-test
output change(4) (5) (6) Y-axis; Normal mode

17

360

LSb

FS bit set to 00
Z-axis; Normal mode

17

360

LSb

-40

+85

°C

Operating
temperature range

1. Typical specifications are not guaranteed.
2. Verified by wafer level test and measurement of initial offset and sensitivity.
3. Typical zero-g level offset value after factory calibration test at socket level.
4. The sign of “Self-test output change” is defined by the ST bits in CTRL_REG4 (23h), for all axes.
5. “Self-test output change” is defined as the absolute value of:
OUTPUT[LSb](Self test enabled) - OUTPUT[LSb](Self test disabled). 1LSb = 4 mg at 10-bit representation, ±2 g full scale
6. After enabling the self-test, correct data is obtained after two samples (low-power mode / normal mode) or after eight
samples (high-resolution mode).

2.2

Temperature sensor characteristics
@ Vdd = 2.5 V, T = 25 °C unless otherwise noted(b)
Table 5. Temperature sensor characteristics

Symbol

Parameter

TSDr

Temperature sensor output change vs. temperature

TODR

Temperature refresh rate

Top

Operating temperature range

Min.

-40

Typ.(1)

Max.

Unit

1

digit/°C(2)

ODR(3)

Hz
+85

°C

1. Typical specifications are not guaranteed.
2. 8-bit resolution.
3. Refer to Table 31.

b. The product is factory calibrated at 2.5 V. Temperature sensor operation is guaranteed in the range 2 V - 3.6 V.

DocID025056 Rev 6

11/53
53

Mechanical and electrical specifications

2.3

LIS2DH12

Electrical characteristics
@ Vdd = 2.5 V, T = 25 °C unless otherwise noted(c)
Table 6. Electrical characteristics

Symbol
Vdd

Parameter

Test conditions

Supply voltage

Vdd_IO

I/O pins supply voltage

Idd

Current consumption
in normal mode

IddLP

Current consumption
in low-power mode

IddPdn

Current consumption
in power-down mode

(2)

VIH

Digital high-level input voltage

VIL

Digital low-level input voltage

VOH

High-level output voltage

VOL

Low-level output voltage

Top

Operating temperature range

Min.

Typ.(1)

Max.

Unit

1.71

2.5

3.6

V

Vdd+0.1

V

1.71
50 Hz ODR

11

μA

1 Hz ODR

2

μA

50 Hz ODR

6

μA

0.5

μA

0.8*Vdd_IO

V
0.2*Vdd_IO

0.9*Vdd_IO

-40

V
0.1*Vdd_IO

V

+85

°C

1. Typical specification are not guaranteed.
2. It is possible to remove Vdd maintaining Vdd_IO without blocking the communication busses, in this condition the
measurement chain is powered off.

c. The product is factory calibrated at 2.5 V. The operational power supply range is from 1.71 V to 3.6 V.

12/53

DocID025056 Rev 6

V

LIS2DH12

Mechanical and electrical specifications

2.4

Communication interface characteristics

2.4.1

SPI - serial peripheral interface
Subject to general operating conditions for Vdd and Top.
Table 7. SPI slave timing values
Value (1)
Symbol

Parameter

Unit
Min

tc(SPC)

SPI clock cycle

fc(SPC)

SPI clock frequency

tsu(CS)

CS setup time

5

th(CS)

CS hold time

20

tsu(SI)

SDI input setup time

5

th(SI)

SDI input hold time

15

tv(SO)

SDO valid output time

th(SO)

SDO output hold time

tdis(SO)

SDO output disable time

Max

100

ns
10

MHz

ns
50

5
50

1. Values are guaranteed at 10 MHz clock frequency for SPI with both 4 and 3 wires, based on characterization results, not
tested in production.

Figure 3. SPI slave timing diagram
CS

(1)

(1)

tc(SPC)

tsu(CS)

SPC

(1)

(1)

tsu(SI)

SDI

(1)

th(SI)
LSB IN

MSB IN

tv(SO)

SDO

th(CS)

(1)

tdis(SO)

th(SO)

MSB OUT

(1)

LSB OUT

(1)

1. When no communication is ongoing, data on SDO is driven by internal pull-up resistors.

Note:

Measurement points are done at 0.2·Vdd_IO and 0.8·Vdd_IO, for both input and output
ports.

DocID025056 Rev 6

13/53
53

Mechanical and electrical specifications

LIS2DH12

I2C - inter-IC control interface

2.4.2

Subject to general operating conditions for Vdd and top.
Table 8. I2C slave timing values
Symbol

Parameter

f(SCL)

I2C standard mode (1)

I2C fast mode (1)

Min

Max

Min

Max

SCL clock frequency

0

100

0

400

tw(SCLL)

SCL clock low time

4.7

1.3

tw(SCLH)

SCL clock high time

4.0

0.6

tsu(SDA)

SDA setup time

250

100

th(SDA)

SDA data hold time

0

th(ST)

START condition hold time

4

0.6

tsu(SR)

Repeated START condition
setup time

4.7

0.6

tsu(SP)

STOP condition setup time

4

0.6

tw(SP:SR)

Bus free time between STOP
and START condition

4.7

1.3

3.45

ns
0.9

Figure 4. I2C slave timing diagram
REPEATED
START

START

tsu(SR)

START

tw(SP:SR)

th(SDA)

tsu(SP)

STOP

SCL

th(ST)

tw(SCLL)

μs

μs

1. Data based on standard I2C protocol requirement, not tested in production.

tsu(SDA)

kHz
μs

0

SDA

Unit

tw(SCLH)

Note:

Measurement points are done at 0.2·Vdd_IO and 0.8·Vdd_IO, for both ports.

14/53

DocID025056 Rev 6

LIS2DH12

2.5

Mechanical and electrical specifications

Absolute maximum ratings
Stresses above those listed as “absolute maximum ratings” may cause permanent damage
to the device. This is a stress rating only and functional operation of the device under these
conditions is not implied. Exposure to maximum rating conditions for extended periods may
affect device reliability.
Table 9. Absolute maximum ratings
Symbol
Vdd
Vdd_IO

Note:

Ratings

Maximum value

Unit

Supply voltage

-0.3 to 4.8

V

Supply voltage on I/O pins

-0.3 to 4.8

V

-0.3 to Vdd_IO +0.3

V

Vin

Input voltage on any control pin
(CS, SCL/SPC, SDA/SDI/SDO, SDO/SA0)

APOW

Acceleration (any axis, powered, Vdd = 2.5 V)

AUNP

Acceleration (any axis, unpowered)

TOP

Operating temperature range

-40 to +85

°C

TSTG

Storage temperature range

-40 to +125

°C

ESD

Electrostatic discharge protection (HBM)

2

kV

3000 g for 0.5 ms
10000 g for 0.2 ms
3000 g for 0.5 ms
10000 g for 0.2 ms

Supply voltage on any pin should never exceed 4.8 V.
This device is sensitive to mechanical shock, improper handling can cause
permanent damage to the part.
This device is sensitive to electrostatic discharge (ESD), improper handling can
cause permanent damage to the part.

DocID025056 Rev 6

15/53
53

Terminology and functionality

LIS2DH12

3

Terminology and functionality

3.1

Terminology

3.1.1

Sensitivity
Sensitivity describes the gain of the sensor and can be determined by applying 1 g
acceleration to it. As the sensor can measure DC accelerations, this can be done easily by
pointing the axis of interest towards the center of the Earth, noting the output value, rotating
the sensor by 180 degrees (pointing to the sky) and noting the output value again. By doing
so, ±1 g acceleration is applied to the sensor. Subtracting the larger output value from the
smaller one, and dividing the result by 2, leads to the actual sensitivity of the sensor. This
value changes very little over temperature and time. The sensitivity tolerance describes the
range of sensitivities of a large population of sensors.

3.1.2

Zero-g level
The zero-g level offset (TyOff) describes the deviation of an actual output signal from the
ideal output signal if no acceleration is present. A sensor in a steady state on a horizontal
surface will measure 0 g for the X-axis and 0 g for the Y-axis whereas the Z-axis will
measure 1 g. The output is ideally in the middle of the dynamic range of the sensor (content
of OUT registers 00h, data expressed as two’s complement number). A deviation from the
ideal value in this case is called zero-g offset. Offset is to some extent a result of stress to
the MEMS sensor and therefore the offset can slightly change after mounting the sensor on
a printed circuit board or exposing it to extensive mechanical stress. Offset changes little
over temperature, see Table 4 “Zero-g level change vs. temperature” (TCOff). The zero-g
level tolerance (TyOff) describes the standard deviation of the range of zero-g levels of a
population of sensors.

3.2

Functionality

3.2.1

High-resolution, normal mode, low-power mode
The LIS2DH12 provides three different operating modes: high-resolution mode, normal
mode and low-power mode.
The table below summarizes how to select the different operating modes.
Table 10. Operating mode selection
CTRL_REG1[3] CTRL_REG4[3]

Operating mode
Low-power mode (8-bit data output)
Normal mode (10-bit data output)
High-resolution mode (12-bit data output)
Not allowed

(1)

BW [Hz]

Turn-on So @ ±2g
time [ms] [mg/digit]

(LPen bit)

(HR bit)

1

0

ODR/2

1

16

0

0

ODR/2

1.6

4

0

1

ODR/9

7/ODR

1

1

1

--

--

--

1. By design, when the device from high-resolution configuration (HR) is set to power-down mode (PD), it is recommended to
read register REFERENCE (26h) for a complete reset of the filtering block before switching to normal/high-performance
mode again.

16/53

DocID025056 Rev 6

LIS2DH12

Terminology and functionality
The turn-on time to transition to another operating mode is given in Table 11.
Table 11. Turn-on time for operating mode transition
Turn-on time

Operating mode change

[ms]

12-bit mode to 8-bit mode

1/ODR

12-bit mode to 10-bit mode

1/ODR

10-bit mode to 8-bit mode

1/ODR

10-bit mode to 12-bit mode

7/ODR

8-bit mode to 10-bit mode

1/ODR

8-bit mode to 12-bit mode

7/ODR

Table 12. Current consumption of operating modes
Operating mode [Hz]

3.2.2

High resolution
Normal mode
Low-power mode
(8-bit data output) (10-bit data output) (12-bit data output)
[μA]
[μA]
[μA]

1

2

2

2

10

3

4

4

25

4

6

6

50

6

11

11

100

10

20

20

200

18

38

38

400

36

73

73

1344

--

185

185

1620

100

--

--

5376

185

--

--

Self-test
The self-test allows the user to check the sensor functionality without moving it. When the
self-test is enabled, an actuation force is applied to the sensor, simulating a definite input
acceleration. In this case the sensor outputs will exhibit a change in their DC levels which
are related to the selected full scale through the device sensitivity. When the self-test is
activated, the device output level is given by the algebraic sum of the signals produced by
the acceleration acting on the sensor and by the electrostatic test-force. If the output signals
change within the amplitude specified inside Table 4, then the sensor is working properly
and the parameters of the interface chip are within the defined specifications.

DocID025056 Rev 6

17/53
53

Terminology and functionality

3.2.3

LIS2DH12

6D / 4D orientation detection
The LIS2DH12 provides the capability to detect the orientation of the device in space,
enabling easy implementation of energy-saving procedures and automatic image rotation
for mobile devices.
The 4D detection is a subset of the 6D function especially defined to be implemented in
mobile devices for portrait and landscape computation. In 4D configuration, the Z-axis
position detection is disabled.

3.2.4

“Sleep-to-wake” and “Return-to-sleep”
The LIS2DH12 can be programmed to automatically switch to low-power mode upon
recognition of a determined event.
Once the event condition is over, the device returns back to the preset normal or highresolution mode.
To enable this function the desired threshold value must be stored inside the ACT_THS
(3Eh) register while the duration value is written inside the ACT_DUR (3Fh) register.
When the acceleration falls below the threshold value, the device automatically switches to
low-power mode (10Hz ODR).
During this condition, the ODR[3:0] bits and the LPen bit inside CTRL_REG1 (20h) and the
HR bit in CTRL_REG4 (23h) are not considered.
As soon as the acceleration rises above threshold, the module restores the operating mode
and ODRs as determined by the CTRL_REG1 (20h) and CTRL_REG4 (23h) settings.

3.3

Sensing element
A proprietary process is used to create a surface micromachined accelerometer. The
technology processes suspended silicon structures which are attached to the substrate in a
few points called anchors and are free to move in the direction of the sensed acceleration.
To be compatible with traditional packaging techniques, a cap is placed on top of the
sensing element to avoid blocking the moving parts during the molding phase of the plastic
encapsulation.
When an acceleration is applied to the sensor, the proof mass displaces from its nominal
position, causing an imbalance in the capacitive half-bridge. This imbalance is measured
using charge integration in response to a voltage pulse applied to the capacitor.
At steady state the nominal value of the capacitors are a few pF and when an acceleration is
applied, the maximum variation of the capacitive load is in the fF range.

3.4

IC interface
The complete measurement chain is composed of a low-noise capacitive amplifier which
converts the capacitive unbalance of the MEMS sensor into an analog voltage that will be
available to the user through an analog-to-digital converter.
The acceleration data may be accessed through an I2C/SPI interface, thus making the
device particularly suitable for direct interfacing with a microcontroller.

18/53

DocID025056 Rev 6

LIS2DH12

Terminology and functionality
The LIS2DH12 features a data-ready signal (DRDY) which indicates when a new set of
measured acceleration data is available, thus simplifying data synchronization in the digital
system that uses the device.
The LIS2DH12 may also be configured to generate an inertial wake-up and free-fall interrupt
signal according to a programmed acceleration event along the enabled axes. Both free-fall
and wake-up can be available simultaneously on two different pins.

3.5

Factory calibration
The IC interface is factory calibrated for sensitivity (So) and zero-g level (TyOff).
The trim values are stored inside the device in non-volatile memory. Any time the device is
turned on, these values are downloaded into the registers to be used during active
operation. This allows using the device without further calibration.

3.6

FIFO
The LIS2DH12 contains a 10-bit, 32-level FIFO. Buffered output allows the following
operation modes: FIFO, Stream, Stream-to-FIFO and FIFO bypass. When FIFO bypass
mode is activated, FIFO is not operating and remains empty. In FIFO mode, measurement
data from acceleration detection on the x, y, and z-axes are stored in the FIFO buffer.

3.7

Temperature sensor
In order to enable the internal temperature sensor, bits TEMP_EN[1:0] in register
TEMP_CFG_REG (1Fh) and the BDU bit in CTRL_REG4 (23h) have to be set.
The temperature is available in OUT_TEMP_L (0Ch), OUT_TEMP_H (0Dh) stored as two’s
complement data, left-justified.
The temperature data format can be 10 bits if LPen (bit 3) in CTRL_REG1 (20h) is cleared
(high-resolution / normal mode), otherwise, in low-power mode, the ADC resolution is 8-bit.
Refer to Table 5: Temperature sensor characteristics for the conversion factor.

DocID025056 Rev 6

19/53
53

Application hints

4

LIS2DH12

Application hints
Figure 5. LIS2DH12 electrical connections

Vdd_IO
100nF

SCL/SPC

1

INT 2

INT 1

Vdd

12

10μF
11

10

Vdd_IO

CS

Vdd

SDO/SA0

GND
4

5

6

7

GND

GND

RES

SDA/SDI/SDO

100nF

GND

Digital signal from/to signal controller. Signal levels are defined by proper selection of Vdd_IO

The device core is supplied through the Vdd line while the I/O pads are supplied through the
Vdd_IO line. Power supply decoupling capacitors (100 nF ceramic, 10 μF aluminum) should
be placed as near as possible to pin 9 of the device (common design practice).
All the voltage and ground supplies must be present at the same time to have proper
behavior of the IC (refer to Figure 5). It is possible to remove Vdd while maintaining Vdd_IO
without blocking the communication bus, in this condition the measurement chain is
powered off.
The functionality of the device and the measured acceleration data is selectable and
accessible through the I2C or SPI interfaces. When using the I2C, CS must be tied high.
The functions, the threshold and the timing of the two interrupt pins (INT1 and INT2) can be
completely programmed by the user through the I2C/SPI interface.

20/53

DocID025056 Rev 6

LIS2DH12

Application hints

Table 13. Internal pin status
Pin#
1

Name
SCL
SPC

Function

Pin status

2

I C serial clock (SCL)
SPI serial port clock (SPC)

Default: input high impedance

SPI enable
2

CS

I2C/SPI mode selection:
1: SPI idle mode / I2C communication enabled

Default: input high impedance

0: SPI communication mode / I2C disabled
3

SDO
SA0

SPI serial data output (SDO)
Default: input with internal pull-up(1)
I2C less significant bit of the device address (SA0)

4

SDA
SDI
SDO

I2C serial data (SDA)
SPI serial data input (SDI)
3-wire interface serial data output (SDO)

5

Res

Connect to GND

6

GND

0 V supply

7

GND

0 V supply

8

GND

0 V supply

9

Vdd

Power supply

10

Vdd_IO

Power supply for I/O pins

11

INT2

Interrupt pin 2

Default: push-pull output forced to GND

12

INT1

Interrupt pin 1

Default: push-pull output forced to GND

Default: (SDA) input high impedance

1. In order to disable the internal pull-up on the SDO/SA0 pin, write 90h in CTRL_REG0 (1Eh).

4.1

Soldering information
The LGA package is compliant with the ECOPACK®, RoHS and “Green” standard.
It is qualified for soldering heat resistance according to JEDEC J-STD-020.
Leave “Pin 1 Indicator” unconnected during soldering.
Land pattern and soldering recommendations are available at www.st.com.

DocID025056 Rev 6

21/53
53

Digital main blocks

LIS2DH12

5

Digital main blocks

5.1

FIFO
The LIS2DH12 embeds a 32-level FIFO for each of the three output channels, X, Y and Z.
This allows consistent power saving for the system, since the host processor does not need
to continuously poll data from the sensor, but it can wake up only when needed and burst
the significant data out from the FIFO.
In order to enable the FIFO buffer, the FIFO_EN bit in CTRL_REG5 (24h) must be set to ‘1’.
This buffer can work according to the following different modes: Bypass mode, FIFO mode,
Stream mode and Stream-to-FIFO mode. Each mode is selected by the FM [1:0] bits in
FIFO_CTRL_REG (2Eh). Programmable FIFO watermark level, FIFO empty or FIFO
overrun events can be enabled to generate dedicated interrupts on the INT1 pin
(configuration through CTRL_REG3 (22h)).
In the FIFO_SRC_REG (2Fh) register the EMPTY bit is equal to ‘1’ when all FIFO samples
are ready and FIFO is empty.
In the FIFO_SRC_REG (2Fh) register the WTM bit goes to ‘1’ if new data is written in the
buffer and FIFO_SRC_REG (2Fh) (FSS [4:0]) is greater than or equal to FIFO_CTRL_REG
(2Eh) (FTH [4:0]). FIFO_SRC_REG (2Fh) (WTM) goes to ‘0’ if reading an X, Y, Z data slot
from FIFO and FIFO_SRC_REG (2Fh) (FSS [4:0]) is less than or equal to
FIFO_CTRL_REG (2Eh) (FTH [4:0]).
In the FIFO_SRC_REG (2Fh) register the OVRN_FIFO bit is equal to ‘1’ if the FIFO slot is
overwritten.

5.1.1

Bypass mode
In Bypass mode the FIFO is not operational and for this reason it remains empty. For each
channel only the first address is used. The remaining FIFO levels are empty.
Bypass mode must be used in order to reset the FIFO buffer when a different mode is
operating (i.e. FIFO mode).

5.1.2

FIFO mode
In FIFO mode, the buffer continues filling data from the X, Y and Z accelerometer channels
until it is full (a set of 32 samples stored). When the FIFO is full, it stops collecting data from
the input channels and the FIFO content remains unchanged.
An overrun interrupt can be enabled, I1_OVERRUN = '1' in the CTRL_REG3 (22h) register,
in order to be raised when the FIFO stops collecting data. When the overrun interrupt
occurs, the first data has been overwritten and the FIFO stops collecting data from the input
channels.
After the last read it is necessary to transit from Bypass mode in order to reset the FIFO
content. After this reset command, it is possible to restart FIFO mode just by selecting the
FIFO mode configuration (FM[1:0] bits) in register FIFO_CTRL_REG (2Eh).

22/53

DocID025056 Rev 6

LIS2DH12

5.1.3

Digital main blocks

Stream mode
In Stream mode the FIFO continues filling data from the X, Y, and Z accelerometer channels
until the buffer is full (a set of 32 samples stored) at which point the FIFO buffer index
restarts from the beginning and older data is replaced by the current data. The oldest values
continue to be overwritten until a read operation frees the FIFO slots.
An overrun interrupt can be enabled, I1_OVERRUN = '1' in the CTRL_REG3 (22h) register,
in order to read the entire contents of the FIFO at once. If, in the application, it is mandatory
not to lose data and it is not possible to read at least one sample for each axis within one
ODR period, a watermark interrupt can be enabled in order to read partially the FIFO and
leave memory slots free for incoming data.
Setting the FTH [4:0] bit in the FIFO_CTRL_REG (2Eh) register to an N value, the number
of X, Y and Z data samples that should be read at the rise of the watermark interrupt is up to
(N+1).

5.1.4

Stream-to-FIFO mode
In Stream-to-FIFO mode, data from the X, Y and Z accelerometer channels are collected in
a combination of Stream mode and FIFO mode. The FIFO buffer starts operating in Stream
mode and switches to FIFO mode when the selected interrupt occurs.
The FIFO operating mode changes according to the INT1 pin value if the TR bit is set to ‘0’
in the FIFO_CTRL_REG (2Eh) register or the INT2 pin value if the TR bit is set to‘1’ in the
FIFO_CTRL_REG (2Eh) register.
When the interrupt pin is selected and the interrupt event is configured on the corresponding
pin, the FIFO operates in Stream mode if the pin value is equal to ‘0’ and it operates in FIFO
mode if the pin value is equal to ‘1’. Switching modes is dynamically performed according to
the pin value.
Stream-to-FIFO can be used in order to analyze the sampling history that generates an
interrupt. The standard operation is to read the contents of FIFO when the FIFO mode is
triggered and the FIFO buffer is full and stopped.

5.1.5

Retrieving data from FIFO
FIFO data is read from OUT_X_L (28h), OUT_X_H (29h), OUT_Y_L (2Ah), OUT_Y_H
(2Bh) and OUT_Z_L (2Ch), OUT_Z_H (2Dh). When the FIFO is in Stream, Stream-to-FIFO
or FIFO mode, a read operation to the OUT_X_L (28h), OUT_X_H (29h), OUT_Y_L (2Ah),
OUT_Y_H (2Bh) or OUT_Z_L (2Ch), OUT_Z_H (2Dh) registers provides the data stored in
the FIFO. Each time data is read from the FIFO, the oldest X, Y and Z data are placed in the
OUT_X_L (28h), OUT_X_H (29h), OUT_Y_L (2Ah), OUT_Y_H (2Bh) and OUT_Z_L (2Ch),
OUT_Z_H (2Dh) registers and both single read and read_burst operations can be used.
The address to be read is automatically updated by the device and it rolls back to 0x28
when register 0x2D is reached. In order to read all FIFO levels in a multiple byte read,192
bytes (6 output registers of 32 levels) have to be read.

DocID025056 Rev 6

23/53
53

Digital interfaces

6

LIS2DH12

Digital interfaces
The registers embedded inside the LIS2DH12 may be accessed through both the I2C and
SPI serial interfaces. The latter may be SW configured to operate either in 3-wire or 4-wire
interface mode.
The serial interfaces are mapped to the same pads. To select/exploit the I2C interface, the
CS line must be tied high (i.e. connected to Vdd_IO).
Table 14. Serial interface pin description
Pin name

6.1

Pin description

CS

SPI enable
I2C/SPI mode selection:
1: SPI idle mode / I2C communication enabled
0: SPI communication mode / I2C disabled

SCL
SPC

I2C serial clock (SCL)
SPI serial port clock (SPC)

SDA
SDI
SDO

I2C serial data (SDA)
SPI serial data input (SDI)
3-wire interface serial data output (SDO)

SA0
SDO

I2C less significant bit of the device address (SA0)
SPI serial data output (SDO)

I2C serial interface
The LIS2DH12 I2C is a bus slave. The I2C is employed to write data into registers whose
content can also be read back.
The relevant I2C terminology is given in the table below.
Table 15. I2C terminology
Term

Description

Transmitter

The device which sends data to the bus

Receiver

The device which receives data from the bus

Master

The device which initiates a transfer, generates clock signals and terminates a
transfer

Slave

The device addressed by the master

There are two signals associated with the I2C bus: the serial clock line (SCL) and the serial
data line (SDA). The latter is a bidirectional line used for sending and receiving data to/from
the interface. Both the lines must be connected to Vdd_IO through an external pull-up
resistor. When the bus is free, both the lines are high.
The I2C interface is compliant with fast mode (400 kHz) I2C standards as well as with
normal mode.

24/53

DocID025056 Rev 6

LIS2DH12

6.1.1

Digital interfaces

I2C operation
The transaction on the bus is started through a START (ST) signal. A START condition is
defined as a HIGH-to-LOW transition on the data line while the SCL line is held HIGH. After
this has been transmitted by the master, the bus is considered busy. The next byte of data
transmitted after the start condition contains the address of the slave in the first 7 bits and
the eighth bit tells whether the master is receiving data from the slave or transmitting data to
the slave. When an address is sent, each device in the system compares the first seven bits
after a start condition with its address. If they match, the device considers itself addressed
by the master.
The Slave ADdress (SAD) associated to the LIS2DH12 is 001100xb. The SDO/SA0 pad can
be used to modify the less significant bit of the device address. If the SA0 pad is connected
to the voltage supply, LSb is ‘1’ (address 0011001b), else if the SA0 pad is connected to
ground, the LSb value is ‘0’ (address 0011000b). This solution permits to connect and
address two different accelerometers to the same I2C lines.
Data transfer with acknowledge is mandatory. The transmitter must release the SDA line
during the acknowledge pulse. The receiver must then pull the data line LOW so that it
remains stable low during the HIGH period of the acknowledge clock pulse. A receiver
which has been addressed is obliged to generate an acknowledge after each byte of data
received.
The I2C embedded inside the LIS2DH12 behaves like a slave device and the following
protocol must be adhered to. After the start condition (ST) a slave address is sent, once a
slave acknowledge (SAK) has been returned, an 8-bit sub-address (SUB) is transmitted: the
7 LSb represent the actual register address while the MSb enables address auto increment.
If the MSb of the SUB field is ‘1’, the SUB (register address) is automatically increased to
allow multiple data read/writes.
The slave address is completed with a Read/Write bit. If the bit is ‘1’ (Read), a repeated
START (SR) condition must be issued after the two sub-address bytes; if the bit is ‘0’ (Write)
the master will transmit to the slave with direction unchanged. Table 16 explains how the
SAD+read/write bit pattern is composed, listing all the possible configurations.
Table 16. SAD+read/write patterns
Command

SAD[6:1]

SAD[0] = SA0

R/W

SAD+R/W

Read

001100

0

1

00110001 (31h)

Write

001100

0

0

00110000 (30h)

Read

001100

1

1

00110011 (33h)

Write

001100

1

0

00110010 (32h)

Table 17. Transfer when master is writing one byte to slave
Master
Slave

ST

SAD + W

SUB
SAK

DocID025056 Rev 6

DATA
SAK

SP
SAK

25/53
53

Digital interfaces

LIS2DH12

Table 18. Transfer when master is writing multiple bytes to slave
Master

ST

SAD + W

SUB

Slave

SAK

DATA

DATA

SAK

SP

SAK

SAK

Table 19. Transfer when master is receiving (reading) one byte of data from slave
Master

ST

SAD + W

Slave

SUB
SAK

SR

SAD + R

SAK

NMAK
SAK

SP

DATA

Table 20. Transfer when master is receiving (reading) multiple bytes of data from slave
Master
Slave

ST

SAD+W

SUB
SAK

SR SAD+R
SAK

MAK
SAK DATA

MAK
DATA

NMAK

SP

DATA

Data are transmitted in byte format (DATA). Each data transfer contains 8 bits. The number
of bytes transferred per transfer is unlimited. Data is transferred with the Most Significant bit
(MSb) first. If a receiver can’t receive another complete byte of data until it has performed
some other function, it can hold the clock line, SCL low to force the transmitter into a wait
state. Data transfer only continues when the receiver is ready for another byte and releases
the data line. If a slave receiver doesn’t acknowledge the slave address (i.e. it is not able to
receive because it is performing some real-time function) the data line must be left HIGH by
the slave. The master can then abort the transfer. A low-to-high transition on the SDA line
while the SCL line is HIGH is defined as a STOP condition. Each data transfer must be
terminated by the generation of a STOP (SP) condition.
In order to read multiple bytes, it is necessary to assert the most significant bit of the subaddress field. In other words, SUB(7) must be equal to 1 while SUB(6-0) represents the
address of the first register to be read.
In the presented communication format MAK is Master acknowledge and NMAK is No
Master Acknowledge.

26/53

DocID025056 Rev 6

LIS2DH12

6.2

Digital interfaces

SPI bus interface
The LIS2DH12 SPI is a bus slave. The SPI allows writing to and reading from the registers
of the device.
The serial interface interacts with the application using 4 wires: CS, SPC, SDI and SDO.
Figure 6. Read and write protocol

&6
63&
6',
5:

', ', ', ', ', ',

', ',

06 $' $' $' $' $' $'

6'2
'2 '2 '2 '2 '2 '2 '2 '2

CS is the serial port enable and it is controlled by the SPI master. It goes low at the start of
the transmission and goes back high at the end. SPC is the serial port clock and it is
controlled by the SPI master. It is stopped high when CS is high (no transmission). SDI and
SDO are respectively the serial port data input and output. These lines are driven at the
falling edge of SPC and should be captured at the rising edge of SPC.
Both the read register and write register commands are completed in 16 clock pulses or in
multiples of 8 in case of multiple read/write bytes. Bit duration is the time between two falling
edges of SPC. The first bit (bit 0) starts at the first falling edge of SPC after the falling edge
of CS while the last bit (bit 15, bit 23, ...) starts at the last falling edge of SPC just before the
rising edge of CS.
bit 0: RW bit. When 0, the data DI(7:0) is written into the device. When 1, the data DO(7:0)
from the device is read. In the latter case, the chip will drive SDO at the start of bit 8.
bit 1: MS bit. When 0, the address will remain unchanged in multiple read/write commands.
When 1, the address is auto incremented in multiple read/write commands.
bit 2-7: address AD(5:0). This is the address field of the indexed register.
bit 8-15: data DI(7:0) (write mode). This is the data that is written into the device (MSb first).
bit 8-15: data DO(7:0) (read mode). This is the data that is read from the device (MSb first).
In multiple read/write commands further blocks of 8 clock periods will be added. When the
MS bit is ‘0’, the address used to read/write data remains the same for every block. When
the MS bit is ‘1’, the address used to read/write data is increased at every block.
The function and the behavior of SDI and SDO remain unchanged.

DocID025056 Rev 6

27/53
53

Digital interfaces

6.2.1

LIS2DH12

SPI read
Figure 7. SPI read protocol
&6
63&
6',
5:
06 $' $' $' $' $' $'

6'2
'2 '2 '2 '2 '2 '2 '2 '2

The SPI read command is performed with 16 clock pulses. A multiple byte read command is
performed by adding blocks of 8 clock pulses to the previous one.
bit 0: READ bit. The value is 1.
bit 1: MS bit. When 0, does not increment the address; when 1, increments the address in
multiple reads.
bit 2-7: address AD(5:0). This is the address field of the indexed register.
bit 8-15: data DO(7:0) (read mode). This is the data that will be read from the device (MSb
first).
bit 16-... : data DO(...-8). Further data in multiple byte reads.
Figure 8. Multiple byte SPI read protocol (2-byte example)

&6
63&
6',
5:
06 $' $' $' $' $' $'

6'2
'2 '2 '2 '2 '2 '2 '2 '2 '2'2'2'2'2'2'2 '2

28/53

DocID025056 Rev 6

LIS2DH12

6.2.2

Digital interfaces

SPI write
Figure 9. SPI write protocol

&6
63&
6',
', ', ', ', ', ', ', ',

5:
06 $' $' $' $' $' $'

The SPI write command is performed with 16 clock pulses. A multiple byte write command
is performed by adding blocks of 8 clock pulses to the previous one.
bit 0: WRITE bit. The value is 0.
bit 1: MS bit. When 0, does not increment the address; when 1, increments the address in
multiple writes.
bit 2 -7: address AD(5:0). This is the address field of the indexed register.
bit 8-15: data DI(7:0) (write mode). This is the data that is written inside the device (MSb
first).
bit 16-... : data DI(...-8). Further data in multiple byte writes.
Figure 10. Multiple byte SPI write protocol (2-byte example)

&6
63&
6',
', ', ', ', ', ', ', ', ',',',',',',', ',

5:
06 $' $' $' $' $' $'

DocID025056 Rev 6

29/53
53

Digital interfaces

6.2.3

LIS2DH12

SPI read in 3-wire mode
3-wire mode is entered by setting the SIM bit (SPI serial interface mode selection) to ‘1’ in
CTRL_REG4 (23h).
Figure 11. SPI read protocol in 3-wire mode

&6
63&
6',2
'2 '2 '2 '2 '2 '2 '2 '2

5:
06 $' $' $' $' $' $'

The SPI read command is performed with 16 clock pulses.
bit 0: READ bit. The value is 1.
bit 1: MS bit. When 0, does not increment the address; when 1, increments the address in
multiple reads.
bit 2-7: address AD(5:0). This is the address field of the indexed register.
bit 8-15: data DO(7:0) (read mode). This is the data that is read from the device (MSb first).
The multiple read command is also available in 3-wire mode.

30/53

DocID025056 Rev 6

LIS2DH12

7

Register mapping

Register mapping
The table given below provides a list of the 8-bit registers embedded in the device and the
corresponding addresses.
Table 21. Register address map
Register address
Name

Type

Default
Hex

Comment

Binary

Reserved

-

00 - 06

Reserved

STATUS_REG_AUX

r

07

Reserved

-

08-0B

OUT_TEMP_L

r

0C

000 1100

Output

OUT_TEMP_H

r

0D

000 1101

Output

Reserved

-

0E

000 1110

WHO_AM_I

r

0F

000 1111

Reserved

-

10 - 1D

CTRL_REG0

rw

1E

001 1110

00010000

TEMP_CFG_REG

rw

1F

001 1111

00000000

CTRL_REG1

rw

20

010 0000

00000111

CTRL_REG2

rw

21

010 0001

00000000

CTRL_REG3

rw

22

010 0010

00000000

CTRL_REG4

rw

23

010 0011

00000000

CTRL_REG5

rw

24

010 0100

00000000

CTRL_REG6

rw

25

010 0101

00000000

REFERENCE

rw

26

010 0110

00000000

STATUS_REG

r

27

010 0111

Output

OUT_X_L

r

28

010 1000

Output

OUT_X_H

r

29

010 1001

Output

OUT_Y_L

r

2A

010 1010

Output

OUT_Y_H

r

2B

010 1011

Output

OUT_Z_L

r

2C

010 1100

Output

OUT_Z_H

r

2D

010 1101

Output

FIFO_CTRL_REG

rw

2E

010 1110

00000000

FIFO_SRC_REG

r

2F

010 1111

Output

INT1_CFG

rw

30

011 0000

00000000

INT1_SRC

r

31

011 0001

Output

INT1_THS

rw

32

011 0010

00000000

000 0111

Output
Reserved

Reserved
00110011

Dummy register
Reserved

DocID025056 Rev 6

31/53
53

Register mapping

LIS2DH12
Table 21. Register address map (continued)
Register address

Name

Type

Default
Hex

Binary

INT1_DURATION

rw

33

011 0011

00000000

INT2_CFG

rw

34

011 0100

00000000

INT2_SRC

r

35

011 0101

Output

INT2_THS

rw

36

011 0110

00000000

INT2_DURATION

rw

37

011 0111

00000000

CLICK_CFG

rw

38

011 1000

00000000

CLICK_SRC

r

39

011 1001

Output

CLICK_THS

rw

3A

011 1010

00000000

TIME_LIMIT

rw

3B

011 1011

00000000

TIME_LATENCY

rw

3C

011 1100

00000000

TIME_WINDOW

rw

3D

011 1101

00000000

ACT_THS

rw

3E

011 1110

00000000

ACT_DUR

rw

3F

011 1111

00000000

Comment

Registers marked as Reserved or not listed in the table above must not be changed. Writing
to those registers may cause permanent damage to the device.
The content of the registers that are loaded at boot should not be changed. They contain the
factory calibration values. Their content is automatically restored when the device is
powered up.
The boot procedure is complete within 5 milliseconds after device power-up.

32/53

DocID025056 Rev 6

LIS2DH12

Register description

8

Register description

8.1

STATUS_REG_AUX (07h)
Table 22. STATUS_REG_AUX register
--

TOR

--

--

--

TDA

--

--

Table 23. STATUS_REG_AUX description

8.2

TOR

Temperature data overrun. Default value: 0
(0: no overrun has occurred;
1: new temperature data has overwritten the previous data)

TDA

Temperature new data available. Default value: 0
(0: new temperature data is not yet available;
1: new temperature data is available)

OUT_TEMP_L (0Ch), OUT_TEMP_H (0Dh)
Temperature sensor data. Refer to Section 3.7: Temperature sensor for details on how to
enable and read the temperature sensor output data.

8.3

WHO_AM_I (0Fh)
Table 24. WHO_AM_I register
0

0

1

1

0

0

1

1

0(1)

0(1)

0(1)

Device identification register.

8.4

CTRL_REG0 (1Eh)
Table 25. CTRL_REG0 register
SDO_PU_DISC

0(1)

0(1)

1(2)

0(1)

1. This bit must be set to 0 for correct operation of the device.
2. This bit must be set to 1 for correct operation of the device.

Table 26. CTRL_REG0 description
Disconnect SDO/SA0 pull-up. Default value: 00010000
SDO_PU_DISC (0: pull-up connected to SDO/SA0 pin;
1: pull-up disconnected to SDO/SA0 pin)

Note:

Leave bits 0 through 6 at the default value in order to ensure correct operation of the device.

DocID025056 Rev 6

33/53
53

Register description

8.5

LIS2DH12

TEMP_CFG_REG (1Fh)
Table 27. TEMP_CFG_REG register
TEMP_EN1 TEMP_EN0

0

0

0

0

0

0

Yen

Xen

Table 28. TEMP_CFG_REG description
TEMP_EN[1:0]

8.6

Temperature sensor (T) enable. Default value: 00
(00: T disabled; 11: T enabled)

CTRL_REG1 (20h)
Table 29. CTRL_REG1 register
ODR3

ODR2

ODR1

ODR0

LPen

Zen

Table 30. CTRL_REG1 description

34/53

ODR[3:0]

Data rate selection. Default value: 0000
(0000: power-down mode; others: refer to Table 31)

LPen

Low-power mode enable. Default value: 0
(0: high-resolution / normal mode, 1: low-power mode)
(Refer to section 3.2.1: High-resolution, normal mode, low-power mode)

Zen

Z-axis enable. Default value: 1
(0: Z-axis disabled; 1: Z-axis enabled)

Yen

Y-axis enable. Default value: 1
(0: Y-axis disabled; 1: Y-axis enabled)

Xen

X-axis enable. Default value: 1
(0: X-axis disabled; 1: X-axis enabled)

DocID025056 Rev 6

LIS2DH12

Register description
ODR[3:0] is used to set the power mode and ODR selection. The following table indicates
the frequency of each combination of ODR[3:0].
Table 31. Data rate configuration
ODR3

ODR2

ODR1

ODR0

Power mode selection

0

0

0

0

Power-down mode

0

0

0

1

HR / Normal / Low-power mode (1 Hz)

0

0

1

0

HR / Normal / Low-power mode (10 Hz)

0

0

1

1

HR / Normal / Low-power mode (25 Hz)

0

1

0

0

HR / Normal / Low-power mode (50 Hz)

0

1

0

1

HR / Normal / Low-power mode (100 Hz)

0

1

1

0

HR / Normal / Low-power mode (200 Hz)

0

1

1

1

HR/ Normal / Low-power mode (400 Hz)

1

0

0

0

Low-power mode (1.620 kHz)

1

0

0

1

HR/ Normal (1.344 kHz);
Low-power mode (5.376 kHz)

By design, when the device from high-resolution configuration (HR) is set to power-down
mode (PD), it is recommended to read register REFERENCE (26h) for a complete reset of
the filtering block before switching to normal/high-performance mode again for proper
device functionality.

DocID025056 Rev 6

35/53
53

Register description

8.7

LIS2DH12

CTRL_REG2 (21h)
Table 32. CTRL_REG2 register
HPM1

HPM0

HPCF2

HPCF1

FDS

HPCLICK

HP_IA2

HP_IA1

Table 33. CTRL_REG2 description
HPM[1:0]

High-pass filter mode selection. Default value: 00
Refer to Table 34 for filter mode configuration

HPCF[2:1]

High-pass filter cutoff frequency selection

FDS

Filtered data selection. Default value: 0
(0: internal filter bypassed; 1: data from internal filter sent to output register and FIFO)

HPCLICK

High-pass filter enabled for CLICK function.
(0: filter bypassed; 1: filter enabled)

HP_IA2

High-pass filter enabled for AOI function on Interrupt 2.
(0: filter bypassed; 1: filter enabled)

HP_IA1

High-pass filter enabled for AOI function on Interrupt 1.
(0: filter bypassed; 1: filter enabled)

Table 34. High-pass filter mode configuration
HPM1

8.8

HPM0

High-pass filter mode

0

0

Normal mode (reset by reading REFERENCE (26h) register)

0

1

Reference signal for filtering

1

0

Normal mode

1

1

Autoreset on interrupt event

CTRL_REG3 (22h)
Table 35. CTRL_REG3 register
I1_CLICK

I1_IA1

I1_IA2

I1_ZYXDA

0(1)

I1_WTM

1. This bit must be set to ‘0’ for correct operation of the device.

Table 36. CTRL_REG3 description

36/53

I1_CLICK

CLICK interrupt on INT1 pin. Default value: 0
(0: disable; 1: enable)

I1_IA1

IA1 interrupt on INT1 pin. Default value: 0
(0: disable; 1: enable)

I1_IA2

IA2 interrupt on INT1 pin. Default value: 0
(0: disable; 1: enable)

I1_ZYXDA

ZYXDA interrupt on INT1 pin. Default value: 0
(0: disable; 1: enable)

I1_WTM

FIFO watermark interrupt on INT1 pin. Default value: 0
(0: disable; 1: enable)

I1_OVERRUN

FIFO overrun interrupt on INT1 pin. Default value: 0
(0: disable; 1: enable)

DocID025056 Rev 6

I1_OVERRUN

--

LIS2DH12

8.9

Register description

CTRL_REG4 (23h)
Table 37. CTRL_REG4 register
BDU

BLE(1)

FS1

FS0

HR

ST1

ST0

SIM

1. The BLE function can be activated only in high-resolution mode

Table 38. CTRL_REG4 description
BDU

Block data update. Default value: 0
(0: continuous update;
1: output registers not updated until MSB and LSB have been read)

BLE

Big/Little Endian data selection. Default value: 0
(0: data LSb at lower address; 1: data MSb at lower address)
The BLE function can be activated only in high-resolution mode

FS[1:0]

Full-scale selection. Default value: 00
(00: ±2 g; 01: ±4 g; 10: ±8 g; 11: ±16 g)

HR

Operating mode selection (refer to section 3.2.1: High-resolution, normal
mode, low-power mode)(1)

ST[1:0]

Self-test enable. Default value: 00
(00: self-test disabled; other: see Table 39)

SIM

SPI serial interface mode selection. Default value: 0
(0: 4-wire interface; 1: 3-wire interface).

1. By design, when the device from high-resolution configuration (HR) is set to power-down mode (PD), it is
recommended to read register REFERENCE (26h) for a complete reset of the filtering block before
switching to normal/high-performance mode again for proper device functionality.

Table 39. Self-test mode configuration
ST1

ST0

Self-test mode

0

0

Normal mode

0

1

Self test 0

1

0

Self test 1

1

1

--

DocID025056 Rev 6

37/53
53

Register description

8.10

LIS2DH12

CTRL_REG5 (24h)
Table 40. CTRL_REG5 register
BOOT

FIFO_EN

--

--

LIR_INT1

D4D_INT1

LIR_INT2

D4D_INT2

Table 41. CTRL_REG5 description

8.11

BOOT

Reboot memory content. Default value: 0
(0: normal mode; 1: reboot memory content)

FIFO_EN

FIFO enable. Default value: 0
(0: FIFO disabled; 1: FIFO enabled)

LIR_INT1

Latch interrupt request on INT1_SRC (31h), with INT1_SRC (31h) register cleared
by reading INT1_SRC (31h) itself. Default value: 0.
(0: interrupt request not latched; 1: interrupt request latched)

D4D_INT1

4D enable: 4D detection is enabled on INT1 pin when 6D bit on INT1_CFG (30h) is
set to 1.

LIR_INT2

Latch interrupt request on INT2_SRC (35h) register, with INT2_SRC (35h) register
cleared by reading INT2_SRC (35h) itself. Default value: 0.
(0: interrupt request not latched; 1: interrupt request latched)

D4D_INT2

4D enable: 4D detection is enabled on INT2 pin when 6D bit on INT2_CFG (34h) is
set to 1.

CTRL_REG6 (25h)
Table 42. CTRL_REG6 register
I2_CLICK

I2_IA1

I2_IA2

I2_BOOT

I2_ACT

--

INT_POLARITY -

Table 43. CTRL_REG6 description

38/53

I2_CLICK

Click interrupt on INT2 pin. Default value: 0
(0: disabled; 1: enabled)

I2_IA1

Enable interrupt 1 function on INT2 pin. Default value: 0
(0: function disabled; 1: function enabled)

I2_IA2

Enable interrupt 2 function on INT2 pin. Default value: 0
(0: function disabled; 1: function enabled)

I2_BOOT

Enable boot on INT2 pin. Default value: 0
(0: disabled; 1: enabled)

I2_ACT

Enable activity interrupt on INT2 pin. Default value: 0
(0: disabled; 1: enabled)

INT_POLARITY

INT1 and INT2 pin polarity. Default value: 0
(0: active-high; 1: active-low)

DocID025056 Rev 6

LIS2DH12

8.12

Register description

REFERENCE (26h)
Table 44. REFERENCE register
Ref7

Ref6

Ref5

Ref4

Ref3

Ref2

Ref1

Ref0

Table 45. REFERENCE description
Ref [7:0]

8.13

Reference value for interrupt generation. Default value: 0

STATUS_REG (27h)
Table 46. STATUS_REG register
ZYXOR

ZOR

YOR

XOR

ZYXDA

ZDA

YDA

XDA

Table 47. STATUS_REG description
ZYXOR

X-, Y- and Z-axis data overrun. Default value: 0
(0: no overrun has occurred; 1: a new set of data has overwritten the previous set)

ZOR

Z-axis data overrun. Default value: 0
(0: no overrun has occurred; 1: new data for the Z-axis has overwritten the previous data)

YOR

Y-axis data overrun. Default value: 0
(0: no overrun has occurred;
1: new data for the Y-axis has overwritten the previous data)

XOR

X-axis data overrun. Default value: 0
(0: no overrun has occurred;
1: new data for the X-axis has overwritten the previous data)

ZYXDA

X-, Y- and Z-axis new data available. Default value: 0
(0: a new set of data is not yet available; 1: a new set of data is available)

ZDA

Z-axis new data available. Default value: 0
(0: new data for the Z-axis is not yet available;
1: new data for the Z-axis is available)

YDA

Y-axis new data available. Default value: 0
(0: new data for the Y-axis is not yet available;
1: new data for the Y-axis is available)

DocID025056 Rev 6

39/53
53

Register description

8.14

LIS2DH12

OUT_X_L (28h), OUT_X_H (29h)
X-axis acceleration data. The value is expressed as two’s complement left-justified.
Please refer to Section 3.2.1: High-resolution, normal mode, low-power mode.

8.15

OUT_Y_L (2Ah), OUT_Y_H (2Bh)
Y-axis acceleration data. The value is expressed as two’s complement left-justified.
Please refer to Section 3.2.1: High-resolution, normal mode, low-power mode.

8.16

OUT_Z_L (2Ch), OUT_Z_H (2Dh)
Z-axis acceleration data. The value is expressed as two’s complement left-justified.
Please refer to Section 3.2.1: High-resolution, normal mode, low-power mode.

8.17

FIFO_CTRL_REG (2Eh)
Table 48. FIFO_CTRL_REG register
FM1

FM0

TR

FTH4

FTH3

FTH2

Table 49. FIFO_CTRL_REG description
FM[1:0]

FIFO mode selection. Default value: 00 (see Table 50)

TR

Trigger selection. Default value: 0
0: trigger event allows triggering signal on INT1
1: trigger event allows triggering signal on INT2

FTH[4:0]

Default value: 00000

Table 50. FIFO mode configuration
FM1

40/53

FM0

FIFO mode

0

0

Bypass mode

0

1

FIFO mode

1

0

Stream mode

1

1

Stream-to-FIFO mode

DocID025056 Rev 6

FTH1

FTH0

LIS2DH12

8.18

Register description

FIFO_SRC_REG (2Fh)
Table 51. FIFO_SRC_REG register
WTM

OVRN_FIFO

EMPTY

FSS4

FSS3

FSS2

FSS1

FSS0

Table 52. FIFO_SRC_REG description

8.19

WTM

WTM bit is set high when FIFO content exceeds watermark level

OVRN_FIFO

OVRN bit is set high when FIFO buffer is full; this means that the FIFO buffer
contains 32 unread samples. At the following ODR a new sample set replaces the
oldest FIFO value. The OVRN bit is set to 0 when the first sample set has been
read

EMPTY

EMPTY flag is set high when all FIFO samples have been read and FIFO is empty

FSS [4:0]

FSS [4:0] field always contains the current number of unread samples stored in the
FIFO buffer. When FIFO is enabled, this value increases at ODR frequency until
the buffer is full, whereas, it decreases every time one sample set is retrieved from
FIFO

INT1_CFG (30h)
Table 53. INT1_CFG register
AOI

6D

ZHIE/

ZLIE

YHIE

YLIE

XHIE

XLIE

Table 54. INT1_CFG description
AOI

And/Or combination of interrupt events. Default value: 0. Refer to Table 55

6D

6-direction detection function enabled. Default value: 0. Refer to Table 55

ZHIE

Enable interrupt generation on Z high event or on direction recognition. Default
value: 0 (0: disable interrupt request;1: enable interrupt request)

ZLIE

Enable interrupt generation on Z low event or on direction recognition. Default value:
0 (0: disable interrupt request;1: enable interrupt request)

YHIE

Enable interrupt generation on Y high event or on direction recognition. Default
value: 0 (0: disable interrupt request; 1: enable interrupt request.)

YLIE

Enable interrupt generation on Y low event or on direction recognition. Default value:
0 (0: disable interrupt request; 1: enable interrupt request.)

XHIE

Enable interrupt generation on X high event or on direction recognition. Default
value: 0 (0: disable interrupt request; 1: enable interrupt request.)

XLIE

Enable interrupt generation on X low event or on direction recognition. Default value:
0 (0: disable interrupt request; 1: enable interrupt request.)

The content of this register is loaded at boot.

DocID025056 Rev 6

41/53
53

Register description

LIS2DH12

A write operation to this address is possible only after system boot.
Table 55. Interrupt mode
AOI

6D

Interrupt mode

0

0

OR combination of interrupt events

0

1

6-direction movement recognition

1

0

AND combination of interrupt events

1

1

6-direction position recognition

The difference between AOI-6D = ‘01’ and AOI-6D = ‘11’.
AOI-6D = ‘01’ is movement recognition. An interrupt is generated when the orientation
moves from an unknown zone to a known zone. The interrupt signal remains for a duration
ODR.
AOI-6D = ‘11’ is direction recognition. An interrupt is generated when the orientation is
inside a known zone. The interrupt signal remains while the orientation is inside the zone.

8.20

INT1_SRC (31h)
Table 56. INT1_SRC register
0

IA

ZH

ZL

YH

YL

XH

XL

Table 57. INT1_SRC description
IA

Interrupt active. Default value: 0
(0: no interrupt has been generated; 1: one or more interrupts have been generated)

ZH

Z high. Default value: 0
(0: no interrupt, 1: Z high event has occurred)

ZL

Z low. Default value: 0
(0: no interrupt; 1: Z low event has occurred)

YH

Y high. Default value: 0
(0: no interrupt, 1: Y high event has occurred)

YL

Y low. Default value: 0
(0: no interrupt, 1: Y low event has occurred)

XH

X high. Default value: 0
(0: no interrupt, 1: X high event has occurred)

XL

X low. Default value: 0
(0: no interrupt, 1: X low event has occurred)

Interrupt 1 source register. Read-only register.
Reading at this address clears the INT1_SRC (31h) IA bit (and the interrupt signal on the
INT1 pin) and allows the refresh of data in the INT1_SRC (31h) register if the latched option
was chosen.

42/53

DocID025056 Rev 6

LIS2DH12

8.21

Register description

INT1_THS (32h)
Table 58. INT1_THS register
0

THS6

THS5

THS4

THS3

THS2

THS1

THS0

D1

D0

Table 59. INT1_THS description

THS[6:0]

8.22

Interrupt 1 threshold. Default value: 000 0000
1 LSb = 16 mg @ FS = 2 g
1 LSb = 32 mg @ FS = 4 g
1 LSb = 62 mg @ FS = 8 g
1 LSb = 186 mg @ FS = 16 g

INT1_DURATION (33h)
Table 60. INT1_DURATION register
0

D6

D5

D4

D3

D2

Table 61. INT1_DURATION description
D[6:0]

Duration value. Default value: 000 0000
1 LSb = 1/ODR

The D[6:0] bits set the minimum duration of the Interrupt 2 event to be recognized. Duration
steps and maximum values depend on the ODR chosen.
Duration time is measured in N/ODR, where N is the content of the duration register.

DocID025056 Rev 6

43/53
53

Register description

8.23

LIS2DH12

INT2_CFG (34h)
Table 62. INT2_CFG register
AOI

6D

ZHIE

ZLIE

YHIE

YLIE

XHIE

XLIE

Table 63. INT2_CFG description
AOI

AND/OR combination of interrupt events. Default value: 0
(see Table 64)

6D

6-direction detection function enabled. Default value: 0. Refer to Table 64.

ZHIE

Enable interrupt generation on Z high event. Default value: 0
(0: disable interrupt request;
1: enable interrupt request on measured accel. value higher than preset threshold)

ZLIE

Enable interrupt generation on Z low event. Default value: 0
(0: disable interrupt request;
1: enable interrupt request on measured accel. value lower than preset threshold)

YHIE

Enable interrupt generation on Y high event. Default value: 0
(0: disable interrupt request;
1: enable interrupt request on measured accel. value higher than preset threshold)

YLIE

Enable interrupt generation on Y low event. Default value: 0
(0: disable interrupt request;
1: enable interrupt request on measured accel. value lower than preset threshold)

XHIE

Enable interrupt generation on X high event. Default value: 0
(0: disable interrupt request;
1: enable interrupt request on measured accel. value higher than preset threshold)

XLIE

Enable interrupt generation on X low event. Default value: 0
(0: disable interrupt request;
1: enable interrupt request on measured accel. value lower than preset threshold)

The content of this register is loaded at boot.
A write operation to this address is possible only after system boot.
Table 64. Interrupt mode
AOI

6D

Interrupt mode

0

0

OR combination of interrupt events

0

1

6-direction movement recognition

1

0

AND combination of interrupt events

1

1

6-direction position recognition

The difference between AOI-6D = ‘01’ and AOI-6D = ‘11’.
AOI-6D = ‘01’ is movement recognition. An interrupt is generated when the orientation
moves from an unknown zone to a known zone. The interrupt signal remains for a duration
ODR.
AOI-6D = ‘11’ is direction recognition. An interrupt is generated when the orientation is
inside a known zone. The interrupt signal remains while the orientation is inside the zone.
44/53

DocID025056 Rev 6

LIS2DH12

8.24

Register description

INT2_SRC (35h)
Table 65. INT2_SRC register
0

IA

ZH

ZL

YH

YL

XH

XL

Table 66. INT2_SRC description
IA

Interrupt active. Default value: 0
(0: no interrupt has been generated; 1: one or more interrupts have been generated)

ZH

Z high. Default value: 0
(0: no interrupt, 1: Z high event has occurred)

ZL

Z low. Default value: 0
(0: no interrupt; 1: Z low event has occurred)

YH

Y high. Default value: 0
(0: no interrupt, 1: Y high event has occurred)

YL

Y low. Default value: 0
(0: no interrupt, 1: Y low event has occurred)

XH

X high. Default value: 0
(0: no interrupt, 1: X high event has occurred)

XL

X low. Default value: 0
(0: no interrupt, 1: X low event has occurred)

Interrupt 2 source register. Read-only register.
Reading at this address clears the INT2_SRC (35h) IA bit (and the interrupt signal on the
INT2 pin) and allows the refresh of data in the INT2_SRC (35h) register if the latched option
was chosen.

8.25

INT2_THS (36h)
Table 67. INT2_THS register
0

THS6

THS5

THS4

THS3

THS2

THS1

THS0

Table 68. INT2_THS description
Interrupt 2 threshold. Default value: 000 0000
THS[6:0]

1 LSb = 16 mg @ FS = 2 g
1 LSb = 32 mg @ FS = 4 g
1 LSb = 62 mg @ FS = 8 g
1 LSb = 186 mg @ FS = 16 g

DocID025056 Rev 6

45/53
53

Register description

8.26

LIS2DH12

INT2_DURATION (37h)
Table 69. INT2_DURATION register
0

D6

D5

D4

D3

D2

D1

D0

Table 70. INT2_DURATION description
Duration value. Default value: 000 0000
1 LSb = 1/ODR(1)

D[6:0]

1. Duration time is measured in N/ODR, where N is the content of the duration register.

The D[6:0] bits set the minimum duration of the Interrupt 2 event to be recognized. Duration
time steps and maximum values depend on the ODR chosen.

8.27

CLICK_CFG (38h)
Table 71. CLICK_CFG register
--

--

ZD

ZS

YD

YS

XD

XS

Table 72. CLICK_CFG description

46/53

ZD

Enable interrupt double-click on Z-axis. Default value: 0
(0: disable interrupt request;
1: enable interrupt request on measured accel. value higher than preset threshold)

ZS

Enable interrupt single-click on Z-axis. Default value: 0
(0: disable interrupt request;
1: enable interrupt request on measured accel. value higher than preset threshold)

YD

Enable interrupt double-click on Y-axis. Default value: 0
(0: disable interrupt request;
1: enable interrupt request on measured accel. value higher than preset threshold)

YS

Enable interrupt single-click on Y-axis. Default value: 0
(0: disable interrupt request;
1: enable interrupt request on measured accel. value higher than preset threshold)

XD

Enable interrupt double-click on X-axis. Default value: 0
(0: disable interrupt request;
1: enable interrupt request on measured accel. value higher than preset threshold)

XS

Enable interrupt single-click on X-axis. Default value: 0
(0: disable interrupt request; 1
: enable interrupt request on measured accel. value higher than preset threshold)

DocID025056 Rev 6

LIS2DH12

8.28

Register description

CLICK_SRC (39h)
Table 73. CLICK_SRC register
IA

DClick

SClick

Sign

Z

Y

X

Table 74. CLICK_SRC description

8.29

IA

Interrupt active. Default value: 0
(0: no interrupt has been generated; 1: one or more interrupts have been generated)

DClick

Double-click enable. Default value: 0 (0: double-click detection disabled,
1: double-click detection enabled)

SClick

Single-click enable. Default value: 0 (0: single-click detection disabled, 1: single-click
detection enabled)

Sign

Click sign. 0: positive detection, 1: negative detection

Z

Z click detection. Default value: 0
(0: no interrupt, 1: Z high event has occurred)

Y

Y click detection. Default value: 0
(0: no interrupt, 1: Y high event has occurred)

X

X click detection. Default value: 0
(0: no interrupt, 1: X high event has occurred)

CLICK_THS (3Ah)
Table 75. CLICK_THS register
LIR_Click

Ths6

Ths5

Ths4

Ths3

Ths2

Ths1

Ths0

Table 76. CLICK_THS register description

8.30

LIR_Click

If the LIR_Click bit is not set, the interrupt is kept high for the duration of the
latency window.
If the LIR_Click bit is set, the interrupt is kept high until the CLICK_SRC (39h)
register is read.

Ths[6:0]

Click threshold. Default value: 000 0000

TIME_LIMIT (3Bh)
Table 77. TIME_LIMIT register
-

TLI6

TLI5

TLI4

TLI3

TLI2

TLI1

TLI0

Table 78. TIME_LIMIT description
TLI[6:0]

Click time limit. Default value: 000 0000

DocID025056 Rev 6

47/53
53

Register description

8.31

LIS2DH12

TIME_LATENCY (3Ch)
Table 79. TIME_LATENCY register
TLA7

TLA6

TLA5

TLA4

TLA3

TLA2

TLA1

TLA0

TW1

TW0

Acth1

Acth0

Table 80. TIME_LATENCY description
TLA[7:0]

8.32

Click time latency. Default value: 0000 0000

TIME_WINDOW (3Dh)
Table 81. TIME_WINDOW register
TW7

TW6

TW5

TW4

TW3

TW2

Table 82. TIME_WINDOW description
TW[7:0]

8.33

Click time window

ACT_THS (3Eh)
Table 83. ACT_THS register
--

Acth6

Acth5

Acth4

Acth3

Acth2

Table 84. ACT_THS description
Acth[6:0]

8.34

Sleep-to-wake, return-to-sleep activation threshold in low-power mode
1 LSb = 16 mg @ FS = 2 g
1 LSb = 32 mg @ FS = 4 g
1 LSb = 62 mg @ FS = 8 g
1 LSb = 186 mg @ FS = 16 g

ACT_DUR (3Fh)
Table 85. ACT_DUR register
ActD7

ActD6

ActD5

ActD4

ActD3

ActD2

Table 86. ACT_DUR description
ActD[7:0]

48/53

Sleep-to-wake, return-to-sleep duration.
1 LSb = (8*1[LSb]+1)/ODR

DocID025056 Rev 6

ActD1

ActD0

LIS2DH12

9

Package information

Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK is an ST trademark.

9.1

LGA-12 package information
Figure 12. LGA-12: package outline and mechanical data

'LPHQVLRQVDUHLQPLOOLPHWHUXQOHVVRWKHUZLVHVSHFLILHG
*HQHUDO7ROHUDQFHLVPPXQOHVVRWKHUZLVHVSHFLILHG
287(5',0(16,216
,7(0
/HQJWK>/@
: LGWK>: @
+HLJKW>+@

',0(16,21>PP@




72/(5$1&(>PP@


0$;

B

DocID025056 Rev 6

49/53
53

Package information

9.2

LIS2DH12

LGA-12 packing information
Figure 13. Carrier tape information for LGA-12 package

Figure 14. LGA-12 package orientation in carrier tape

50/53

DocID025056 Rev 6

LIS2DH12

Package information
Figure 15. Reel information for carrier tape of LGA-12 package
7

PPPLQ
$FFHVVKROHDW
VORWORFDWLRQ

%
&

$

1

'

)XOOUDGLXV

*PHDVXUHGDWKXE 
7DSHVORW
LQFRUHIRU
WDSHVWDUW
PPPLQZLGWK

Table 87. Reel dimensions for carrier tape of LGA-12 package
Reel dimensions (mm)
A (max)

330

B (min)

1.5

C

13 ±0.25

D (min)

20.2

N (min)

60

G

12.4 +2/-0

T (max)

18.4

DocID025056 Rev 6

51/53
53

Revision history

10

LIS2DH12

Revision history
Table 88. Document revision history
Date

Revision

06-Aug-2013

1

Initial release

23-Oct-2015

2

Added Section 9.2: LGA-12 packing information

02-Dec-2015

3

Corrected orientation of X and Y axes in Figure 2: Pin connections
Corrected chamfer of pin 1 in Figure 5: LIS2DH12 electrical connections
Updated default values in Table 21: Register address map
Modified register 0Eh to “Reserved” in Table 21 and removed from
Section 8: Register description
Corrected typo in Table 87: Reel dimensions for carrier tape of LGA-12 package

23-May-2016

4

Updated Table 1: Device summary
Updated APOW and AUNP in Table 9: Absolute maximum ratings

08-Nov-2016

5

Updated Table 2: Pin description
Added Table 3: Internal pull-up values (typ.) for SDO/SA0 pin
Updated Section 3.7: Temperature sensor
Added Table 13: Internal pin status
Updated CTRL_REG2 (21h)
Updated Section 8: Register description
Minor textual updates

05-May-2017

6

Added footnote 1 to Table 10 concerning power-down from high-resolution mode
Updated CTRL_REG1 (20h)
Added footnote 1 to HR bit description in CTRL_REG4 (23h)

52/53

Changes

DocID025056 Rev 6

LIS2DH12

IMPORTANT NOTICE – PLEASE READ CAREFULLY
STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and
improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on
ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order
acknowledgement.
Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or
the design of Purchasers’ products.
No license, express or implied, to any intellectual property right is granted by ST herein.
Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product.
ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners.
Information in this document supersedes and replaces information previously supplied in any prior versions of this document.
© 2017 STMicroelectronics – All rights reserved

DocID025056 Rev 6

53/53
53

